IP Library Assignment 061620/0753
Patent Assignment
Reel/Frame 061620/0753

Assignment of Assignor's Interest

Recorded: 2022-10-06 Pages: 10
Assignors
MARIN, BRANDON C.
Executed: 2022-08-15
DARMAWIKARTA, KRISTOF KUWAWI
Executed: 2022-09-01
PIETAMBARAM, SRINIVAS V.
Executed: 2022-08-15
DUAN, GANG
Executed: 2022-08-18
DUONG, BENJAMIN T.
Executed: 2022-09-02
NAD, SUDDHASATTWA
Executed: 2022-08-24
ECTON, JEREMY
Executed: 2022-08-18
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
Package Substrate with Embedded Bridge Dies
Application: 17/929,045 →
Publication: US 2024/0079339
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 14, 2026
From: INTEL CORPORATION
To: INTEL FOUNDRY IP LLC
Reel/Frame 076007/0292 →