Patent Assignment
Reel/Frame 058363/0660
Assignment of Assignor's Interest
Recorded: 2021-12-10
Pages: 11
Assignors
ELSHERBINI, ADEL A.
Executed: 2021-12-06
PELTO, CHRISTOPHER M.
Executed: 2021-12-02
JUN, KIMIN
Executed: 2021-12-02
RAWLINGS, BRANDON M.
Executed: 2021-12-02
LIFF, SHAWNA M.
Executed: 2021-12-03
JACKSON, BRADLEY A.
Executed: 2021-12-08
MUNOZ, ROBERT J.
Executed: 2021-12-02
SWAN, JOHANNA M.
Executed: 2021-12-03
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Packaging Architecture with Patterned Through-Dielectric Vias and Redistribution Layers
Application:
17/548,078 →
Publication:
US 2023/0187362
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.