Patent Assignment
Reel/Frame 060300/0905
Assignment of Assignor's Interest
Recorded: 2022-06-24
Pages: 4
Assignor
SUGITA, ATSUHIKO
Executed: 2022-05-19
Assignee
SEIKO EPSON CORPORATION
1-6, SHINJUKU 4-CHOME, SHINJUKU-KU, TOKYO, 160-8801, JAPAN
Covered Property
(1)
Injection Molding Apparatus And Mold Of Injection Molding Apparatus