Patent Assignment
Reel/Frame 060316/0498
Assignment of Assignor's Interest
Recorded: 2022-06-27
Pages: 4
Assignors
CHUNG, CHIA-LING
Executed: 2022-06-21
CHENG, CHUN-CHIH
Executed: 2022-06-21
CHUANG, YING-LIANG
Executed: 2022-06-21
YEH, MING-HSI
Executed: 2022-06-21
HUANG, KUO-BIN
Executed: 2022-06-21
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6,, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device and Manufacturing Method Thereof
Application:
17/809,030 →
Publication:
US 2023/0420543