Patent Assignment
Reel/Frame 060325/0722
Assignment of Assignor's Interest
Recorded: 2022-06-27
Pages: 9
Assignors
RARAVIKAR, NACHIKET R.
Executed: 2016-11-28
MAHAJAN, RAVINDRANATH V.
Executed: 2016-11-21
SANKMAN, ROBERT L.
Executed: 2016-11-21
MATAYABAS, JAMES C., JR.
Executed: 2016-11-28
HACKENBERG, KEN P.
Executed: 2016-11-27
MAHANTA, NAYANDEEP K.
Executed: 2016-11-22
OLMOZ, DAVID D.
Executed: 2016-11-21
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Multi-Chip Packages and Sinterable Paste for Use with Thermal Interface Materials