Patent Assignment
Reel/Frame 060343/0195
Assignment of Assignor's Interest
Recorded: 2022-06-28
Pages: 6
Assignors
CHIU, PO-WEI
Executed: 2022-04-19
CHEN, TZU-NO
Executed: 2022-04-22
SHI, HONG
Executed: 2022-06-27
WENG, LI-SHENG
Executed: 2022-04-18
LEE, YOUNG SOO
Executed: 2022-04-22
Assignee
XILINX, INC.
2100 LOGIC DRIVE, SAN JOSE, CALIFORNIA, 95124
Covered Property
(1)
Coupled Loop and Void Structure Integrated in a Redistribution Layer of a Chip Package