Patent Assignment
Reel/Frame 060351/0144
Assignment of Assignor's Interest
Recorded: 2022-06-29
Pages: 4
Assignors
LAI, PO-CHEN
Executed: 2022-06-28
YEW, MING-CHIH
Executed: 2022-06-28
WANG, CHIN-HUA
Executed: 2022-06-28
JENG, SHIN-PUU
Executed: 2022-06-28
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
NO. 8, LI-HSIN 6 ROAD, HSINCHU SCIENCE PARK, HSINCHU, ROC 30077, TAIWAN
Covered Property
(1)
Semiconductor Package Including Stress Buffers and Methods of Forming the Same