Patent Assignment
Reel/Frame 060370/0495
Assignment of Assignor's Interest
Recorded: 2022-06-30
Pages: 11
Assignees
TOKYO INSTITUTE OF TECHNOLOGY
2-12-1, OOKAYAMA, MEGURO-KU,, TOKYO, 152-8550, JAPAN
ADVANTEST CORPORATION
1-6-2, MARUNOUCHI, CHIYODA-KU,, TOKYO, 100-0005, JAPAN
Covered Property
(1)
Semiconductor Device Having Wiring Part Without Being Exposed from Substrate