Patent Assignment
Reel/Frame 060395/0043
Assignment of Assignor's Interest
Recorded: 2022-07-05
Pages: 7
Assignors
CHEAH, BOK ENG
Executed: 2022-06-20
LIM, SEOK LING
Executed: 2022-06-17
ONG, JENNY SHIO YIN
Executed: 2022-06-20
KONG, JACKSON CHUNG PENG
Executed: 2022-06-17
OOI, KOOI CHI
Executed: 2022-06-20
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Semiconductor Packages for Stacked Memory-on-Package (Smop) and Methods of Manufacturing the Same