Patent Assignment
Reel/Frame 060396/0657
Assignment of Assignor's Interest
Recorded: 2022-07-05
Pages: 7
Assignors
PARK, JUN MO
Executed: 2022-05-27
PARK, YEON HO
Executed: 2022-05-27
PARK, EUN SIL
Executed: 2022-05-27
LEE, JIN SEOK
Executed: 2022-05-27
LIM, WANG SEOP
Executed: 2022-05-27
CHOI, KYU BONG
Executed: 2022-05-27
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device with Multiple Sheet Patterns
Application:
17/852,658 →
Publication:
US 2023/0086174