IP Library › Assignment 060405/0975
Patent Assignment
Reel/Frame 060405/0975

Assignment of Assignor's Interest

Recorded: 2022-07-06 Pages: 5
Assignors
TUNG, YU-CHENG
Executed: 2022-07-04
ZHANG, JANBO
Executed: 2022-05-16
Assignee
FUJIAN JINHUA INTEGRATED CIRCUIT CO., LTD.
NO.88, LIANHUA AVENUE, INTEGRATED CIRCUIT SCIENCE PARK, JINJIANG CITY, QUANZHOU CITY, FUJIAN PROVINCE, CHINA
Covered Property (1)
Semiconductor Device Including Dielectric Insert Structure Directly Under Buried Word Line and Method for Forming the Same
Application: 17/858,100 →
Publication: US 2023/0335491