Patent Assignment
Reel/Frame 060411/0993
Assignment of Assignor's Interest
Recorded: 2022-07-06
Pages: 4
Assignors
LEE, HSIN-YI
Executed: 2022-06-27
LIAO, SHAN-MEI
Executed: 2022-06-27
YU, KUO-FENG
Executed: 2022-06-27
LEE, DA-YUAN
Executed: 2022-06-27
CHANG, WENG
Executed: 2022-06-27
CHUI, CHI ON
Executed: 2022-06-27
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device and Formation Method Thereof