Patent Assignment
Reel/Frame 060421/0752
Assignment of Assignor's Interest
Recorded: 2022-07-01
Pages: 6
Assignors
OHTOU, TETSU
Executed: 2018-08-20
TSAI, CHING-WEI
Executed: 2018-07-17
CHENG, KUAN-LUN
Executed: 2018-07-10
OKUNO, YASUTOSHI
Executed: 2018-07-19
HUANG, JIUN-JIA
Executed: 2018-07-23
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device and Manufacturing Method Thereof