Patent Assignment
Reel/Frame 060431/0685
Assignment of Assignor's Interest
Recorded: 2022-07-07
Pages: 6
Assignors
HWANG, HYEONJEONG
Executed: 2022-05-13
KIM, DONGKYU
Executed: 2022-05-13
KIM, MINJUNG
Executed: 2022-05-13
YOO, TAEWON
Executed: 2022-05-13
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method of Fabricating the Same