IP Library › Assignment 060474/0262
Patent Assignment
Reel/Frame 060474/0262

Assignment of Assignor's Interest

Recorded: 2022-07-11 Pages: 5
Assignors
JIN, HWAIL
Executed: 2022-06-09
KO, JI-HAN
Executed: 2022-04-01
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property (1)
Semiconductor Package
Application: 17/841,184 →
Publication: US 2023/0109292