Patent Assignment
Reel/Frame 060474/0319
Assignment of Assignor's Interest
Recorded: 2022-07-11
Pages: 4
Assignee
HANGZHOU GUANGZHIYUAN TECHNOLOGY CO., LTD.
ROOM 1001, 10TH FLOOR, BUILDING 6, FINANCIAL CITY, CANGQIAN STREET, YUHANG DISTRICT, HANGZHOU, CHINA
Covered Property
(1)
Three-Dimentional Packaging Method and Package Structure of Photonic-Electronic Chip
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.