Patent Assignment
Reel/Frame 064677/0627
Assignment of Assignor's Interest
Recorded: 2023-08-23
Pages: 3
Assignor
YU, SHANSHAN
Executed: 2023-08-21
Assignee
HANGZHOU GUANGZHIYUAN TECHNOLOGY CO., LTD.
ROOM 1001, 10TH FLOOR, BUILDING 6, FINANCIAL CITY, CANGQIAN STREET, YUHANG DISTRICT, HANGZHOU, CHINA
Covered Property
(1)
Three-Dimentional Packaging Method and Package Structure of Photonic-Electronic Chip
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.