Patent Assignment
Reel/Frame 060494/0371
Assignment of Assignor's Interest
Recorded: 2022-07-13
Pages: 5
Assignors
TAKAI, KENJI
Executed: 2020-01-13
KIM, DO YOON
Executed: 2020-01-13
YOON, BOUN
Executed: 2020-01-15
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Metal Structure and Method of Manufacturing the Same and Metal Wire and Semiconductor Device and Electronic Device