Patent Assignment
Reel/Frame 060523/0293
Assignment of Assignor's Interest
Recorded: 2022-07-15
Pages: 3
Assignors
YEH, DER-CHYANG
Executed: 2022-07-12
YEH, SUNG-FENG
Executed: 2022-07-12
HONG, JIAN-WEI
Executed: 2022-07-12
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Circuit Packages and Methods of Forming the Same
Application:
17/865,969 →
Publication:
US 2023/0335534