Patent Assignment
Reel/Frame 060524/0258
Assignment of Assignor's Interest
Recorded: 2022-07-15
Pages: 5
Assignors
HWANG, JUNSIK
Executed: 2022-07-04
HONG, SEOGWOO
Executed: 2022-07-01
HWANG, KYUNGWOOK
Executed: 2022-07-01
KIM, HYUNJOON
Executed: 2022-07-01
PARK, JOONYONG
Executed: 2022-07-01
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Micro Semiconductor Chip Transfer Substrate, Display Transferring Structure, Display Device, and Method of Manufacturing the Display Device