Patent Assignment
Reel/Frame 060533/0605
Assignment of Assignor's Interest
Recorded: 2022-07-18
Pages: 4
Assignors
FOUNTAIN, JR., GAIUS GILLMAN
Executed: 2022-07-15
HUDSON, GEORGE CARLTON
Executed: 2022-07-15
Assignee
INVENSAS BONDING TECHNOLOGIES, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Through-Substrate Vias with Metal Plane Layers and Methods of Manufacturing the Same
Application:
17/731,847 →
Publication:
US 2023/0352369
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
May 3, 2023
From: ADEIA GUIDES INC.; ADEIA IMAGING LLC; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063529/0272 →
Change of Name
Sep 23, 2024
From: INVENSAS BONDING TECHNOLOGIES, INC.
To: ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Reel/Frame 069015/0812 →