IP Library › Assignment 069015/0812
Patent Assignment
Reel/Frame 069015/0812

Change of Name

Recorded: 2024-09-23 Pages: 5
Assignor
Assignee
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Properties (2)
Through-Substrate Vias with Metal Plane Layers and Methods of Manufacturing the Same
Application: 17/731,847 →
Publication: US 2023/0352369
Embedded Cooling Systems and Methods of Manufacturing Embedded Cooling Systems
Application: 17/876,376 →
Publication: US 2024/0038633
Related Assignments (3)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 18, 2022
From: FOUNTAIN, JR., GAIUS GILLMAN; HUDSON, GEORGE CARLTON
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 060533/0605 →
Security Interest May 3, 2023
From: ADEIA GUIDES INC.; ADEIA IMAGING LLC; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063529/0272 →
Assignment of Assignor's Interest Aug 24, 2023
From: HABA, BELGACEM; WORKMAN, THOMAS; UZOH, CYPRIAN EMEKA; GAO, GUILIAN
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 064695/0650 →