Embedded cooling systems and methods of manufacturing embedded cooling systems
Embodiments herein provide for fluidic cooling assemblies embedded within a device package and related manufacturing methods. In one embodiment, the cooling assembly includes a cold plate body attached to a singulated device and a manifold lid attached to the cold plate body. The cold plate body has a first side adjacent to the singulated device and an opposite second side, and the manifold lid is attached to the second side. In some embodiments, the first side of the cold plate body and the backside of the singulated device each comprise a dielectric material surface, the cold plate body is attached to the singulated device by direct dielectric bonds formed between the dielectric material surfaces, the cold plate body, and the manifold lid define one or more cavities, and the one or more cavities form at least a portion of a fluid flow path from an inlet to an outlet of the manifold lid.
1. A cooling assembly attached to a singulated device, the cooling assembly comprising:
a cold plate body comprising a first side adjacent to the singulated device and an opposite second side; and
a manifold lid attached to the second side, wherein:
the cold plate body and the singulated device each comprise copper features disposed in respective bonding surfaces;
the cold plate body is attached to the singulated device by direct dielectric-to-dielectric bonds formed between the bonding surface of the first side of the cold plate body and the bonding surface of a backside of the singulated device and by direct metal bonds formed between the copper features;
the cold plate body and the manifold lid define one or more cavities; and
the one or more cavities form at least a portion of a fluid flow path from an inlet to an outlet of the manifold lid.
2. The cooling assembly of claim 1 , wherein:
sidewall surfaces of the cold plate body and the singulated device are substantially coplanar with each other.
3. The cooling assembly of claim 2 , wherein the sidewall surfaces of the cold plate body are substantially perpendicular to the backside of the singulated device.
4. The cooling assembly of claim 1 , wherein sidewall surfaces of the manifold lid are substantially coplanar with sidewall surfaces of the cold plate body.
5. A cooling assembly comprising:
a cold plate body comprising a first side adjacent to a singulated device and an opposite second side; and
a manifold lid attached to the second side, wherein:
the cold plate body comprises a plurality of base plates arranged in a stack;
the cold plate body is attached to the singulated device by direct dielectric-to-dielectric bonds formed between a bonding surface of the first side of the cold plate body and a bonding surface of a backside of the singulated device;
the cold plate body and the manifold lid define one or more cavities; and
the one or more cavities form at least a portion of a fluid flow path from an inlet to an outlet of the manifold lid.
6. The cooling assembly of claim 5 , wherein:
the plurality of base plates comprises a lower base plate directly bonded to the singulated device and an upper base plate directly bonded to the lower base plate; and
the fluid flow path sequentially comprises a first cavity disposed between the upper base plate and the manifold lid, a second cavity disposed between the upper base plate and the lower base plate, and a third cavity disposed between the manifold lid and the upper base plate.
7. The cooling assembly of claim 5 , wherein:
the plurality of base plates comprises a lower base plate, an upper base plate, and one or more intervening base plates disposed between the lower and upper base plates; and
the fluid flow path sequentially comprises a first cavity disposed between the upper base plate and the manifold lid, a second cavity disposed between the upper base plate and the one or more intervening base plates, and a third cavity disposed between the one or more intervening base plates and the lower base plate.
8. The cooling assembly of claim 1 , wherein:
the cold plate body comprises one or more monocrystalline or polycrystalline silicon substrates; and
the manifold lid comprises a metal, a polymer, or an epoxy material.
9. The cooling assembly of claim 1 , wherein:
the manifold lid and the cold plate body have different coefficients of thermal expansion; and
the manifold lid is attached to the cold plate body by an adhesive material layer.
10. The cooling assembly of claim 1 , wherein at least a portion of the backside of the singulated device is directly exposed to the fluid flow path.
11. A cooling assembly attached to a singulated device, the cooling assembly comprising:
a cold plate body comprising a first side adjacent to the singulated device and an opposite second side; and
a manifold lid attached to the second side, wherein:
the cold plate body and the singulated device each comprise copper features disposed in respective bonding surfaces;
the cold plate body is directly bonded to the singulated device by direct dielectric-to-dielectric bonds formed between the bonding surface of the first side of the cold plate body and the bonding surface of the singulated device and by direct metal bonds formed between the copper features;
the bonding surfaces of the cold plate body and the singulated device are substantially flush with each other; and
the cold plate body and the manifold lid define one or more cavities that form at least a portion of a fluid flow path from an inlet to an outlet of the manifold lid.
12. The cooling assembly of claim 11 , wherein:
sidewall surfaces of the cold plate body and the singulated device are substantially coplanar with each other.
13. The cooling assembly of claim 12 , wherein the sidewall surfaces of the cold plate body are substantially perpendicular to the backside of the singulated device.
14. The cooling assembly of claim 11 , wherein sidewall surfaces of the manifold lid are substantially coplanar with sidewall surfaces of the cold plate body.
15. The cooling assembly of claim 11 , wherein the cold plate body comprises a plurality of base plates arranged in a stack.
16. The cooling assembly of claim 15 , wherein:
the plurality of base plates comprises a lower base plate directly bonded to the singulated device and an upper base plate directly bonded to the lower base plate; and
the fluid flow path sequentially comprises a first cavity disposed between the upper base plate and the manifold lid, a second cavity disposed between the upper base plate and the lower base plate, and a third cavity disposed between the manifold lid and the upper base plate.
17. The cooling assembly of claim 15 , wherein:
the plurality of base plates comprises a lower base plate, an upper base plate, and one or more intervening base plates disposed between the lower and upper base plates; and
the fluid flow path sequentially comprises a first cavity disposed between the upper base plate and the manifold lid, a second cavity disposed between the upper base plate and the one or more intervening base plates, and a third cavity disposed between the one or more intervening base plates and the lower base plate.
18. The cooling assembly of claim 11 , wherein:
the cold plate body comprises one or more monocrystalline or polycrystalline silicon substrates; and
the manifold lid comprises a metal, a polymer, or an epoxy material.
19. The cooling assembly of claim 11 , wherein:
the manifold lid and the cold plate body have different coefficients of thermal expansion; and
the manifold lid is attached to the cold plate body by an adhesive material layer.
20. The cooling assembly of claim 11 , wherein at least a portion of a backside of the singulated device is directly exposed to the fluid flow path.
21. The cooling assembly of claim 1 , wherein the cold plate comprises sloped sidewalls formed by a wet etch.
22. The cooling assembly of claim 1 , wherein the cold plate comprises substantially vertical sidewalls formed by a dry etch.
23. The cooling assembly of claim 11 , wherein the cold plate comprises sloped sidewalls formed by a wet etch.
24. The cooling assembly of claim 11 , wherein the cold plate comprises substantially vertical sidewalls formed by a dry etch.
25. The cooling assembly of claim 1 , wherein a first cavity of the one or more cavities forms a first portion of the fluid flow path, the cooling assembly further comprising:
a plurality of features protruding into the first cavity, wherein the plurality of features defines a plurality of channels in the first portion of the fluid flow path.
26. The cooling assembly of claim 11 , wherein a first cavity of the one or more cavities forms a first portion of the fluid flow path, the cooling assembly further comprising:
a plurality of features protruding into the first cavity, wherein the plurality of features defines a plurality of channels in the first portion of the fluid flow path.
27. The cooling assembly of claim 6 , wherein the fluid flow path comprises a third cavity, different from the first cavity, disposed between the manifold lid and the upper base plate.
28. The cooling assembly of claim 7 , wherein the fluid flow path comprises a fourth cavity, different from the first cavity, disposed between the upper base plate and the manifold lid.
29. The cooling assembly of claim 16 , wherein the fluid flow path comprises a third cavity, different from the first cavity, disposed between the manifold lid and the upper base plate.
30. The cooling assembly of claim 17 , wherein the fluid flow path comprises a fourth cavity, different from the first cavity, disposed between the upper base plate and the manifold lid.