Modular technique for die-level liquid cooling
An integrated circuit assembly including a first die including a device side and a backside opposite the device side; and a second die including a plurality of fluidly accessible channels therein, wherein the second die is coupled to a backside of the first die. A method of fabricating an integrated circuit assembly including coupling a first die to a second die, wherein the first die includes a device side and an opposite backside, wherein the device side includes a plurality of integrated circuits and wherein the second die includes a plurality of fluidly accessible channels therein.
1. An integrated circuit assembly comprising:
a first die comprising a device side and a backside opposite the device side, the first die having a lateral width;
a second die comprising a plurality of fluidly accessible channels therein, the second die having a lateral width, wherein the second die is coupled to a backside of the first die by copper to copper bonds, and wherein the lateral width of the first die is at least as great as the lateral width of the second die; and
a manifold over the second die, the manifold comprising an inlet, an outlet, a distributor assembly, and a collector assembly, the distributor assembly comprising a plurality of distributors having openings in fluid communication with a first portion of the plurality of fluidly accessible channels of the second die, and the collector assembly comprising a plurality of collectors having openings in fluid communication with a second portion of the plurality of fluidly accessible channels of the second die.
2. The integrated circuit assembly of claim 1 , further comprising a lid disposed on the second die, the lid comprising an area dimension that covers an area comprising the channels.
3. The integrated circuit assembly of claim 2 , wherein the lid comprises a fluid inlet and a fluid outlet.
4. The integrated circuit assembly of claim 1 , wherein a material of the first die and a material of the second die are each a semiconductor material.
5. An integrated circuit assembly comprising:
at least one package comprising:
a first die comprising a device side and a backside opposite the device side, the first die having a lateral width;
a second die coupled to the backside of the first die by copper to copper bonds, the second die comprising a plurality of channels therein and a fluid inlet operable to deliver a fluid to the plurality of channels and a fluid outlet, and the second die having a lateral width, wherein the lateral width of the first die is at least as great as the lateral width of the second die;
a manifold over the second die, the manifold comprising an inlet, an outlet, a distributor assembly, and a collector assembly, the distributor assembly comprising a plurality of distributors having openings in fluid communication with a first portion of the plurality of channels of the second die, and the collector assembly comprising a plurality of collectors having openings in fluid communication with a second portion of the plurality of channels of the second die; and
a package substrate coupled to the device side of the die.
6. The integrated circuit assembly of claim 5 , wherein the at least one package further comprises a lid disposed on the second die, the lid comprising an area dimension that covers an area comprising the channels.
7. The integrated circuit assembly of claim 6 , wherein the lid comprises the fluid inlet and the fluid outlet.
8. The integrated circuit assembly of claim 5 , further comprising a support disposed on the at least one package such that the first die and the second die are disposed between the package substrate and the support.
9. The integrated circuit assembly of claim 5 , further comprising an integrated heat spreader coupled to the package substrate and encapsulating a portion of the at least one package, the integrated heat spreader comprising an inlet port coupled to the fluid inlet and an outlet port coupled to the fluid outlet.
10. The integrated circuit assembly of claim 9 , wherein the at least one package comprises a first package and a second package.
11. The integrated circuit assembly of claim 10 , wherein the inlet port of the integrated heat spreader is coupled to the fluid inlet of the first package and the fluid outlet of the first package is coupled to fluid inlet of the second package and the outlet port of the integrated heat spreader is coupled to the fluid outlet of the second package.
12. An integrated circuit assembly comprising:
at least one package comprising:
a first die comprising a device side and a backside opposite the device side;
a second die coupled to the backside of the first die, the second die comprising a plurality of channels therein and a fluid inlet operable to deliver a fluid to the plurality of channels and a fluid outlet;
a package substrate coupled to the device side of the die; and
an integrated heat spreader coupled to the package substrate and encapsulating a portion of the at least one package, the integrated heat spreader comprising an inlet port coupled to the fluid inlet and an outlet port coupled to the fluid outlet, wherein the at least one package comprises a first package and a second package.
13. The integrated circuit assembly of claim 12 , wherein the inlet port of the integrated heat spreader is coupled to the fluid inlet of the first package and the fluid outlet of the first package is coupled to fluid inlet of the second package and the outlet port of the integrated heat spreader is coupled to the fluid outlet of the second package.