Universal patterned metal thermal interface

1. A thermal interface for coupling a first solid to a second solid, the thermal interface comprising:

a patterned metal insert having a first exterior side positioned to contact the first solid and a second exterior side positioned to contact the second solid;

a corrosion resistant layer coated directly onto at least one of the first exterior side and the second exterior side prior to the thermal interface being deployed between the first solid and the second solid, for protecting the patterned metal insert from corrosion, a metallic bond coupling the corrosion resistant layer to the patterned metal insert; and

an organic layer coated directly onto the corrosion resistant layer prior to the thermal interface being deployed between the first solid and the second solid, for facilitating bonding of the patterned metal insert to one of the first solid and the second solid;

wherein the at least one of the first exterior side and the second exterior side that is coated by the corrosion resistant layer is unpatterned, and

wherein an interior volume of the patterned metal insert is patterned.

2. The thermal interface of claim 1 , wherein the patterned metal insert is patterned on one of the first exterior side and the second exterior side.

3. The thermal interface of claim 1 , wherein the interior volume comprises a plurality of inclusions.

4. The thermal interface of claim 3 , wherein the inclusions comprise at least one of: a gas, a polymer, a shell filled with a gas, a shell filled with a polymer, or a rubber-like material.

5. The thermal interface of claim 1 , wherein the patterned metal insert comprises at least one of: a metal foil, a metal mesh, or a perforated metal sheet.

6. The thermal interface of claim 1 , wherein the patterned metal insert comprises at least one of: indium, tin, indium-tin, lead, gold, silver, bismuth, antimony, thallium or gallium.

7. The thermal interface of claim 1 , wherein the corrosion resistant layer comprises at least one of: titanium, tantalum, tungsten, nickel, gold, or platinum.

8. The thermal interface of claim 1 , wherein the organic layer comprises at least one of: an adhesive, a polymer, an oil, a wax, or a paraffin.

9. The thermal interface of claim 1 , wherein the first exterior side and the second exterior side define an outer boundary of the patterned metal insert.

10. The thermal interface of claim 1 , wherein the patterned metal insert comprises an array of metal lumps held together by an organic binder.

11. The thermal interface of claim 1 , wherein the patterned metal insert, the corrosion resistant layer, and the organic layer together comprise a unitary structure that is removable as a whole from between the first solid and the second solid.

12. The thermal interface of claim 1 , wherein the corrosion resistant layer is formed from a material that is more noble than a material from which the patterned metal insert is formed.

13. A method for coupling a first solid to a second solid using a thermal interface, the method comprising:

positioning the thermal interface between a first surface of the first solid and a first surface of the second solid, the thermal interface comprising: a patterned metal insert having a first exterior side positioned to contact the first solid and a second exterior side positioned to contact the second solid;

metallic bonding a corrosion resistant layer coated directly onto at least one of the first exterior side and the second exterior side of the patterned metal insert prior to the positioning, for protecting the patterned metal insert from corrosion; and

an organic layer coated directly onto the corrosion resistant layer prior to the positioning, for facilitating bonding of the patterned metal insert to one of the first solid and the second solid; and

compressing the thermal interface between the first surface of the first solid and the first surface of the second solid such that the patterned metal insert deforms;

wherein the at least one of the first exterior side and the second exterior side that is coated by the corrosion resistant layer is unpatterned, and

wherein an interior volume of the patterned metal insert is patterned.

14. The method of claim 13 , wherein the first solid is a heat generating device, and the second solid is a heat sink.

15. The method of claim 13 , wherein the patterned metal insert, the corrosion resistant layer, and the organic layer are pre-assembled as the thermal interface prior to the positioning.