Microchannel heat sink
A microchannel heat sink as well as method includes one or more microchannels through which a working fluid flows to remove heat from a heat-generating component, such as a microelectronic chip, and one or more recesses disposed in a surface communicated to the one or more of the microchannel to enhance heat transfer rate of the microchannel heat sink. The recesses can be located in a surface of a cover that closes off the microchannels. The one or more recesses can be located at one or more local hot spot regions to enhance heat transfer rates at the local regions as well as overall heat removal rate of the heat sink.
1. Microchannel heat sink comprising a microchannel for receiving a working fluid to remove heat and one or more recesses disposed in a surface communicated to the microchannel to enhance heat transfer rate of the microchannel heat sink.
2. The heat sink of claim 1 wherein the one or more recesses is/are located at one or more local hot spot regions of a heat-generating component to enhance heat transfer rates at the one or more local regions.
3. The heat sink of claim 1 further including a cover that closes off the microchannel, the cover having one or more recesses in a cover surface facing the microchannels such that the recesses communicate to the microchannels and the working fluid to enhance heat transfer rate of the microchannel heat sink.
4. The heat sink of claim 1 wherein the one or more recesses are elongated and extend in a direction transverse to a long axis of a plurality of the microchannels across one, some or all of the microchannels so as to communicate to one, some or all of the microchannels.
5. The heat sink of claim 4 wherein the one or more recesses extend perpendicular to the long axis.
6. Microchannel heat sink comprising a plurality of microchannels for receiving a working fluid to remove heat and a cover that closes off the microchannels, the cover having one or more recesses in a cover surface facing the microchannels such that the recesses communicate to the microchannels and the working fluid to enhance heat transfer rate of the microchannel heat sink.
7. The heat sink of claim 6 wherein the one or more recesses is/are located at one or more local hot spot regions of a heat-generating component to enhance heat transfer rates at the one or more local regions.
8. The heat sink of claim 6 wherein the one or more recesses are elongated and extend in a direction transverse to a long axis of the microchannels across one, some or all of the microchannels so as to communicate to one, some or all of the microchannels.
9. The heat sink of claim 8 wherein the one or more recesses extend in a direction perpendicular to the long axis.
10. Combination of a heat-generating electronic component and the microchannel heat sink of claim 1 in thermal conductive relation with the component.
11. The combination of claim 10 wherein the microchannel is formed integrally in a surface of the component.
12. The combination of claim 10 wherein the component comprises a microelectronic chip.
13. A method of cooling a heat-generating electronic component, comprising disposing the microchannel heat sink of claim 1 in thermal transfer relation with the component and flowing the working fluid through the microchannel to remove heat from the component.
14. A method of cooling a heat-generating electronic component having one or more hot spots, comprising disposing the microchannel heat sink of claim 1 in thermal transfer relation with the component with the one or more recesses disposed in relation to the one or more hot spots to enhance heat transfer rate there and flowing the working fluid through the microchannel to remove heat from the component.
15. The heat sink of claim 1 wherein heat transfer coefficient is increased at a downstream end region of the one or more recesses.