Bump integrated thermoelectric cooler
An IC package, comprising a first IC component comprising a first interconnect on a first surface thereof; a second IC component comprising a second interconnect on a second surface thereof. The second component is above the first component, and the second surface is opposite the first surface. A thermoelectric cooling (TEC) device is between the first surface and the second surface. The TEC device is electrically coupled to the first interconnect and to the second interconnect.
1. An IC package, comprising:
a first IC component comprising a plurality of first interconnects on a first surface of an IC die;
a second IC component comprising a plurality of second interconnects on a second surface thereof, wherein the second surface is opposite the first surface and wherein the second IC component is electrically coupled to the first IC component through a plurality of electrically conductive joints between the first interconnects and the second interconnects; and
a thermoelectric cooling (TEC) device between the first surface and the second surface and laterally adjacent to the joints, wherein the TEC device comprises a thermoelectric material that has a first interface with a first trace on the first IC component.
2. The IC package of claim 1 , wherein the second IC component is an IC package substrate.
3. The IC package of claim 1 , wherein the first IC component is a first IC device and the second IC component is a second IC device.
4. The IC package of claim 1 , wherein the electrically conductive joints each comprise a solder feature.
5. The IC package of claim 1 , wherein the thermoelectric material has a second interface with a solder feature bonded to the second IC component.
6. The IC package of claim 5 , wherein the thermoelectric material comprises a first island comprising a n-type material and a second island comprising a p-type material, wherein the first island is adjacent to the second island, wherein a first solder feature is on the first island, and a second solder feature is on the second island, and wherein the first solder feature and the second solder feature are bonded to the second IC component.
7. The IC package of claim 6 , wherein the first island has a direct interface with the first trace, and the second island has a direct interface with a second trace on the first IC component, and wherein the first trace has a first thickness, and the second trace has a second thickness, and wherein the first thickness is unequal to the second thickness.
8. The IC package of claim 1 , wherein the TEC device comprises a first island comprising a n-type thermoelectric material and a second island comprising a p-type thermoelectric material, wherein the first island is adjacent to the second island, and wherein the first island has a direct interface with the first trace on the first IC component, and a second island has a direct interface with a second trace on the second IC component.
9. The IC package of claim 8 , wherein a first solder feature is between the first island and the second trace, wherein a second solder feature is between the second island and a third trace on the first IC component, and wherein the first island is bonded to the second trace by the first solder feature, and the second island is bonded to the third trace by the second solder feature.
10. The IC package of claim 9 , wherein the first island is electrically coupled to the second island by the third trace.
11. The IC package of claim 1 , wherein the thermoelectric material comprises any one of bismuth, tellurium, selenium, antimony, phosphorus, arsenic, lead, gallium, tin, indium, zinc, cobalt, copper, nickel, iron, vanadium, iridium, zirconium, niobium, lanthanum, neodymium, samarium, gold, barium, strontium, titanium, silicon, germanium or oxygen.
12. The IC package of claim 1 , wherein the TEC device has a thickness of 50 microns or less.
13. A system comprising:
an IC package coupled to a printed circuit board, the IC package comprising a memory and a microprocessor coupled to the memory, the IC package comprising:
a first IC component comprising a plurality of first interconnects on a first surface of an IC die;
a second IC component comprising a plurality of second interconnects on a second surface thereof, wherein the second surface is opposite the first surface and wherein the second IC component is electrically coupled to the first IC component through a plurality of electrically conductive joints between the first interconnects and the second interconnects; and
a thermoelectric cooling (TEC) device between the first surface and the second surface and laterally adjacent to the joints, wherein the TEC device comprises a thermoelectric material that has a first interface with a first trace on the first component;
a power source coupled to the printed circuit board; and
a controller coupled to the TEC device.
14. The system of claim 13 , wherein the controller is coupled to the printed circuit board.
15. The system of claim 13 , wherein the controller is coupled to a temperature sensor adjacent to the TEC device.