Gyroscope packaging assembly

1. A packaged resonator gyroscope, comprising:

a carrier;

a substrate mounted on top of the carrier;

a baseplate mounted on top of the substrate to define a cavity between the substrate and the baseplate; and

a single disc resonator hanging from the baseplate by a rigid central support and suspended in the cavity between the substrate and the baseplate, the resonator comprising a plurality of circumferential segments disposed about the rigid central support to define a plurality of circumferential slots and a plurality of electrodes disposed in the plurality of circumferential slots, whereby the resonator can detect movement in multiple orientations.

2. The packaged resonator gyroscope of claim 1 , wherein the substrate is mounted to the carrier by a hard mount.

3. The packaged resonator gyroscope of claim 1 , wherein the substrate is mounted to the carrier by at least one solder ball.

4. The packaged resonator gyroscope of claim 3 , wherein the at least one solder ball comprises a thermal pillar bump.

5. The packaged resonator gyroscope of claim 1 , wherein the substrate is mounted to the carrier by at least one pillar.

6. The packaged resonator gyroscope of claim 1 , wherein:

the baseplate comprises at least a first electrical interconnect;

the substrate comprises at least a second electrical interconnect; and

the first electrical interconnect is coupled to the second electrical interconnect.

7. The packaged resonator gyroscope of claim 6 , wherein the baseplate is electrically coupled to the first electrical interconnect via an electrically conductive solder ball.

8. The packaged resonator gyroscope of claim 1 , wherein:

at least a portion of the substrate is removed to define a plurality of cantilevered sections; and

the baseplate is coupled to the substrate on at least one of the plurality of cantilevered sections.

9. The packaged resonator gyroscope of claim 1 , further comprising a cap to enclose the resonator package.

10. The packaged resonator gyroscope of claim 9 , further comprising a getter layer coupled to the cap.

11. The packaged resonator gyroscope of claim 1 , further comprising a thermoelectric cooling module.

12. A method of packaging a planar resonator gyroscope, comprising:

mounting a planar resonator die comprising a single disc planar resonator hanging from a baseplate by a rigid central support onto a substrate to define a cavity between the substrate and the baseplate, such that the resonator is suspended in the cavity between the substrate and the baseplate, the resonator comprising a plurality of circumferential segments disposed about the rigid central support to define a plurality of circumferential slots and a plurality of electrodes disposed in the plurality of circumferential slots, whereby the resonator can detect movement in multiple orientations;

mounting the substrate to a carrier; and

securing a cap to the carrier.

13. The method of claim 12 , wherein mounting a planar resonator die comprising a planar resonator and a baseplate onto a substrate comprises establishing electrical connections between the baseplate and the substrate.

14. The method of claim 12 , wherein mounting the substrate to a carrier comprises establishing a hard mount.

15. The method of claim 12 , wherein mounting the substrate to a carrier comprises securing the substrate to the carrier using at least one solder ball.

16. The method of claim 12 , wherein mounting the substrate to a carrier comprises securing the substrate to the carrier using at least one pillar.

17. The method of claim 16 , further comprising establishing an electrical connection between the substrate and at least one lead wire.

18. The method of claim 12 , wherein:

at least a portion of the substrate is removed to define a plurality of cantilevered sections; and

the baseplate is coupled to the substrate on at least one of the plurality of cantilevered sections.

19. The method of claim 12 , wherein, further comprising securing a getter layer to the cap.