Cooling apparatus, semiconductor device including the apparatus, and manufacturing method thereof
A cooling apparatus may include a microchannel structure including a plurality of microchannels and a manifold disposed over the plurality of microchannels. The microchannel structure may be directly bonded to a chip and dissipate heat generated in the chip during an operation of the chip. The microchannel structure may further include a base over which the plurality of microchannels are disposed and a plurality of fins spaced apart from each other and disposed over the base.
1 . A cooling apparatus comprising:
a microchannel structure including a plurality of microchannels, a base over which the plurality of microchannels are disposed, and a plurality of fins spaced apart from each other and disposed over the base; and
a manifold disposed over the plurality of microchannels,
wherein the microchannel structure is directly bonded to a chip and configured to dissipate heat generated in the chip during an operation of the chip,
wherein a portion of the chip, or one or more of the fins, or both include one or more impurity elements,
wherein the manifold includes:
an inlet main channel extending in a first direction and configured to receive a coolant fluid;
a plurality of inlet subchannels coupled to the inlet main channel and extending in a second direction;
an outlet main channel extending in the first direction and configured to discharge the coolant fluid; and
a plurality of outlet subchannels coupled to the outlet main channel and extending in the second direction,
wherein each of the inlet subchannels has a first width in the first direction that decreases along the second direction, and each of the outlet subchannels has a second width in the first direction that increases along the second direction, and
wherein each of the outlet subchannels has a height in a third direction that increases along the second direction to increase a cross-sectional area through which the coolant flows along the second direction.
2 . The apparatus of claim 1 , wherein the impurity elements include Boron Arsenide or Boron Phosphorous.
3 . A cooling apparatus comprising:
a microchannel structure including a plurality of microchannels, a base over which the plurality of microchannels are disposed, and a plurality of fins spaced apart from each other and disposed over the base; and
a manifold disposed over the plurality of microchannels,
wherein the microchannel structure is directly bonded to a chip and configured to dissipate heat generated in the chip during an operation of the chip,
wherein the plurality of microchannels includes a plurality of first microchannels and a plurality of second microchannels,
wherein a first zone includes a first portion of the manifold and the first microchannels, the first zone being disposed over a first region of the chip with first power density generated during the operation of the chip,
wherein a second zone includes a second portion of the manifold and the second microchannels, the second zone being disposed over a second region of the chip with second power density generated during the operation of the chip, the second power density being different from the first power density,
wherein the apparatus further comprises a flow distribution device configured to control a first flow rate of a coolant in the first zone and a second flow rate of the coolant in the second zone independently based on respective amounts of heat generated in the first and second zones.
4 . The apparatus of claim 3 , wherein an adjacent pair of the fins and a portion of the base between the adjacent pair define a corresponding one of the plurality of microchannels.
5 . The apparatus of claim 4 , wherein each of the plurality of microchannels has a rough surface.
6 . The apparatus of claim 5 , further comprising a plurality of structures, each of the structures being disposed on a sidewall of a corresponding one of the fins and configured to oscillate toward and away from the sidewall.
7 . The apparatus of claim 3 , wherein the plurality of microchannels includes a plurality of first microchannels completely penetrating a first plate and a plurality of second microchannels partially penetrating a second plate, the first plate being disposed over the second plate.
8 . The apparatus of claim 7 , wherein the first microchannels have substantially the same width and pitch as those of the second microchannels.
9 . The apparatus of claim 7 , wherein the first microchannels have width and pitch that are greater than those of the second microchannels.
10 . The apparatus of claim 3 , wherein the first portion of the manifold includes a first path intersecting the first microchannels and the second portion of the manifold includes a second path intersecting the second microchannels, so as to cause a first portion of the coolant to flow through the first path and cause a second portion of the coolant to flow through the second path flow in parallel with each other.
11 . A semiconductor device, comprising:
a chip; and
a cooling apparatus configured to dissipate heat generated in the chip during an operation of the chip, the cooling apparatus including a plurality of microchannels, a base over which the plurality of microchannels are disposed, and a plurality of fins spaced apart from each other and disposed over the base, and a manifold disposed over the plurality of microchannels,
wherein a portion of the chip, or one or more of the fins, or both include one or more impurity elements,
wherein the plurality of microchannels includes a plurality of first microchannels and a plurality of second microchannels,
wherein a first zone includes a first portion of the manifold and the first microchannels, the first zone being disposed over a first region of the chip with first power density generated during the operation of the chip,
wherein a second zone includes a second portion of the manifold and the second microchannels, the second zone being disposed over a second region of the chip with second power density generated during the operation of the chip, the second power density being different from the first power density, and
wherein the cooling apparatus further comprises a flow distribution device configured to control a first flow rate of a coolant in the first zone and a second flow rate of the coolant in the second zone independently based on respective amounts of heat generated in the first and second zones.
12 . The device of claim 11 , further comprising:
a substrate over which the chip is disposed;
a cover coupled to the substrate to cover the cooling apparatus and the chip; and
a plurality of mechanical seals disposed between the cover and the cooling apparatus.
13 . The device of claim 12 , wherein the manifold has an upper surface on which a plurality of columns are disposed, and the plurality of the mechanical seals are inserted into the plurality of columns, respectively.