Fin geometries for manifold microchannel heat sinks
View Patent ↗Embodiments disclosed herein describe manifold microchannel heat sinks having a gridded microchannel assembly with free-form fin geometries for cooling heat-generating devices in the electronics modules. In an embodiment, a manifold microchannel heat sink includes a target surface and a gridded microchannel assembly comprising a plurality of microchannel cells. Each microchannel cell is surrounded by thermally-conductive sidewalls and includes a fluid inlet, a microchannel structure fluidly coupled to the fluid inlet and a fluid outlet. The microchannel structure extends from the target surface and defines a microchannel extending in a normal direction with respect to the target surface. The microchannel structure includes a base plate disposed on the target surface and a three-dimensional fin structure disposed on the base plate. The three-dimensional fin structure has a shape optimized for thermal performance and fluid performance.
1. A manifold microchannel heat sink comprising:
a target surface;
a gridded microchannel assembly comprising a plurality of microchannel cells, wherein each microchannel cell comprises:
a fluid inlet;
a microchannel structure fluidly coupled to the fluid inlet, the microchannel structure extending from the target surface and defining a microchannel extending in a normal direction with respect to the target surface, wherein the microchannel structure comprises:
a base plate disposed on the target surface; and
a three-dimensional fin structure disposed on the base plate;
a fluid outlet fluidly coupled to the microchannel structure, and
an insert disposed over the gridded microchannel assembly comprising a plurality of laterally extending inlet dividers and a plurality of laterally extending outlet dividers interlaced with the plurality of extending inlet dividers.
2. The manifold microchannel heat sink of claim 1 , wherein the insert is formed from a thermally-insulating material.
3. The manifold microchannel heat sink of claim 1 , wherein the three-dimensional fin structure is formed from one or more of the following: copper, nickel, and aluminum.
4. The manifold microchannel heat sink of claim 1 , wherein the three-dimensional fin structure is fabricated using one or more of the following: three-dimensional printing, rapid investment casting, and additive manufacturing.
5. The manifold microchannel heat sink of claim 1 , wherein the microchannel provides a flow path of the cooling fluid in both parallel and normal directions with respect to the target surface.
6. An electronics module comprising:
a manifold microchannel heat sink comprising:
a target surface;
a gridded microchannel assembly comprising a plurality of microchannel cells, wherein each microchannel cell comprises:
a fluid inlet;
a microchannel structure fluidly coupled to the fluid inlet, the microchannel structure extending from the target surface and defining a microchannel extending in a normal direction with respect to the target surface, wherein the microchannel structure comprises:
a base plate disposed on the target surface; and
a three-dimensional fin structure disposed on the base plate; and
a fluid outlet fluidly coupled to the microchannel structure;
an insert disposed over the gridded microchannel assembly comprising a plurality of laterally extending inlet dividers and a plurality of laterally extending outlet dividers interlaced with the plurality of extending inlet dividers; and
a semiconductor device thermally coupled to the target surface.
7. The electronics module of claim 6 , wherein the insert is formed from a thermally-insulating material.
8. The electronics module of claim 6 , wherein the three-dimensional fin structure is formed from one or more of the following: copper, nickel, and aluminum.
9. The electronics module of claim 6 , wherein the three-dimensional fin structure is fabricated using one or more of the following: three-dimensional printing, rapid investment casting, and additive manufacturing.
10. The electronics module of claim 6 , wherein the gridded microchannel assembly is sealably disposed within a heat exchanger manifold having an inlet manifold and an outlet manifold such that the inlet manifold is fluidly coupled to the fluid inlet and the outlet manifold is fluidly coupled to the fluid outlet.
11. The electronics module of claim 6 , wherein the microchannel provides a flow path of the cooling fluid in both parallel and normal directions with respect to the target surface.
12. A vehicle comprising:
an electric motor; and
an electronics module electrically coupled to the electric motor, the electronics module comprising:
a manifold microchannel heat sink comprising:
a target surface;
a gridded microchannel assembly comprising a plurality of microchannel cells, wherein each microchannel cell comprises:
a fluid inlet;
a microchannel structure fluidly coupled to the fluid inlet, the microchannel structure extending from the target surface and defining a microchannel extending in a normal direction with respect to the target surface, wherein the microchannel structure comprises:
a base plate disposed on the target surface; and
a three-dimensional fin structure disposed on the base plate; and
a fluid outlet fluidly coupled to the microchannel structure;
an insert disposed over the gridded microchannel assembly comprising a plurality of laterally extending inlet dividers and a plurality of laterally extending outlet dividers interlaced with the plurality of extending inlet dividers; and
a semiconductor device thermally coupled to the target surface.
13. The vehicle of claim 12 , wherein the insert is formed from a thermally-insulating material.
14. The vehicle of claim 12 , wherein the three-dimensional fin structure is formed from one or more of the following: copper, nickel, and aluminum.
15. The vehicle of claim 12 , wherein the three-dimensional fin structure is fabricated using one or more of the following: three-dimensional printing, rapid investment casting, and additive manufacturing.
16. The vehicle of claim 12 , wherein the gridded microchannel assembly is sealably disposed within a heat exchanger manifold having an inlet manifold and an outlet manifold such that the inlet manifold is fluidly coupled to the fluid inlet and the outlet manifold is fluidly coupled to the fluid outlet.
17. The vehicle of claim 12 , wherein the microchannel provides a flow path of the cooling fluid in both parallel and normal directions with respect to the target surface.
18. The manifold microchannel heat sink of claim 1 , wherein the three-dimensional fin structure has a free-form shape in three dimensions.
19. The electronics module of claim 6 , wherein the three-dimensional fin structure has a free-form shape in three dimensions.
20. The vehicle of claim 12 , wherein the three-dimensional fin structure has a free-form shape in three dimensions.