Thermal management of electronics using co-located microjet nozzles and electronic elements
An electronics assembly in which microjet nozzles are co-located with electronic elements on the same substrate or layer. This technique may be used to integrate lower power-density electronics onto an existing microjet nozzle plate to perform microjet nozzle cooling, which removes the need for separate thermal management solutions for systems that contain both high and lower power-density elements in proximity. This technique may also be used in multilayered 3D integrated electronic substrates, allowing for thin, high performing thermal management solutions in 3D integrated stackups using microjets.
1. An electronics assembly, comprising:
a first layer with a thickness;
at least one active heat-generating electronic element located in the first layer;
at least one passageway, co-located in the first layer with the at least one active heat-generating electronic element, that passes entirely through the thickness of the first layer, wherein the passageway is configured to conduct fluid therethrough, to extract heat from the at least one active heat-generating electronic element located in the first layer;
a second layer that is spaced from the first layer;
a second active heat-generating electronic element located in the second layer; and
a manifold layer between the first and second layers that defines a reservoir that is configured to hold fluid.
2. The assembly of claim 1 , wherein the at least one passageway that passes entirely through the thickness of the first layer comprises a microjet nozzle that is configured to form a microjet.
3. The assembly of claim 2 , further comprising a second passageway, co-located in the second layer with the second active heat-generating electronic element, that passes entirely through the thickness of the second layer, wherein the second passageway is configured to conduct fluid therethrough, to extract heat from the second active heat-generating electronic element located in the second layer.
4. The assembly of claim 1 , wherein the manifold layer comprises a fluid outlet.
5. The assembly of claim 1 , where the at least one passageway that passes entirely through the first layer is non-uniformly configured to provide cooling to hot spots on the second layer.
6. The assembly of claim 1 , further comprising at least one structure spanning the spacing between the first and second layers such that the structure is in contact with the first and second layer.
7. The assembly of claim 6 , where the at least one structure is configured to conduct heat.
8. The assembly of claim 6 , where the at least one structure is configured to provide structural support of the electronics assembly.
9. The assembly of claim 6 , where the at least one structure is configured to aid fluid routing.
10. The assembly of claim 1 , where the at least one passageway that passes entirely through the thickness of the first layer contains a chamfer.