Patent Assignment
Reel/Frame 060565/0509
Assignment of Assignor's Interest
Recorded: 2022-07-20
Pages: 3
Assignors
AHN, JOSEPH
Executed: 2022-03-14
KOO, KYUNGHA
Executed: 2022-03-14
MOON, HONGKI
Executed: 2022-03-14
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Electronic Device Including Heat Dissipation Structure