Granted Patent B2

US 12,204,384 · App. 17/869,109 · Granted Jan 21, 2025

Inventors: Joseph Ahn (Suwon-si, KR); Kyungha Koo (Suwon-si, KR); Hongki Moon (Suwon-si, KR)

Assignee: SAMSUNG ELECTRONICS CO., LTD.

G06F1/203G06F1/1616G06F1/1626H04M1/0216H04M1/026H05K5/0226H05K5/04H05K7/20481H05K7/20963H04M1/02H04M1/0268H05K5/0018

Abstract

Claims (37)

1. An electronic device comprising:

a housing including a first housing and a second housing;

a hinge module comprising a hinge accommodated in the housing and connected to the first housing and the second housing;

a display accommodated inside the housing, and including a first display area accommodated in the first housing, a second display area accommodated in the second housing and a folding area positioned between the first display area and the second display area;

a support disposed in the housing, including an opening between a front surface and a rear surface of the support, and including a side wall surrounding the opening; and

a heat dissipation structure at least a portion of which is positioned in the opening which is a portion of the support and bonded to the side wall,

wherein the heat dissipation structure comprises a heat dissipation layer having a first thermal conductivity and a protective layer having a second thermal conductivity,

wherein the second thermal conductivity is lower than the first thermal conductivity,

wherein the protective layer is covering at least a portion of the heat dissipation layer, and

wherein at least a portion of the opening faces the folding area, and a third area of the heat dissipation structure, which is positioned to correspond to the folding area, comprises a pattern comprising at least one recess.

2. The electronic device according to claim 1 , wherein the protective layer comprises a first protective layer disposed on a first side of the heat dissipation layer and a second protective layer disposed on a second side the heat dissipation layer opposite the first side.

3. The electronic device according to claim 1 , wherein the heat dissipation structure comprises a clad in which the heat dissipation layer and the protective layer are bonded.

4. The electronic device according to claim 1 , wherein the support comprises at least one of stainless steel, aluminum, titanium, or magnesium, and wherein the side wall comprises a groove accommodating at least a portion of the protective layer.

5. The electronic device according to claim 1 , wherein the heat dissipation layer comprises at least one of copper, aluminum, or magnesium.

6. The electronic device according to claim 1 , wherein the protective layer comprises at least one of stainless steel, magnesium, titanium, or aluminum.

7. The electronic device according to claim 1 , wherein a first thickness of the heat dissipation layer is in a range of ⅓ to ⅔ of a second thickness of the heat dissipation structure.

8. The electronic device according to claim 1 , wherein a second modulus of elasticity of the protective layer is greater than a first modulus of elasticity of the heat dissipation layer.

9. The electronic device according to claim 1 , wherein a second yield strength of the protective layer is greater than a first yield strength of the heat dissipation layer.

10. The electronic device according to claim 1 , wherein the support further comprises a resin, and

wherein the side wall comprises a groove accommodating at least a portion of the protective layer.

11. The electronic device according to claim 10 , wherein the support comprises an overlapping area facing the heat dissipation structure and comprises an uneven structure.

12. The electronic device according to claim 1 , wherein a thickness of the heat dissipation structure is in a range of 0.01 mm to 1 mm.

13. The electronic device according to claim 1 , further comprising a battery disposed inside the housing,

wherein at least a portion of the heat dissipation structure faces at least a portion of the battery.

14. An electronic device comprising:

a housing comprising a first housing and a second housing;

a hinge module comprising a hinge accommodated in the housing and connected to the first housing and the second housing;

a display disposed over the first housing, the hinge module, and the second housing;

a support comprising a first side wall positioned inside the first housing and a second side wall positioned inside the second housing; and

a heat dissipation structure comprising a first area bonded to the first side wall, a second area bonded to the second side wall, and a third area positioned between the first area and the second area, and configured to be folded based on the third area,

wherein the heat dissipation structure comprises a heat dissipation layer having a first thermal conductivity and a protective layer having a second thermal conductivity, and

wherein the second thermal conductivity is lower than the first thermal conductivity, the protective layer is covering at least a portion of the heat dissipation layer.

15. The electronic device according to claim 14 , wherein the protective layer comprises a first protective layer disposed on a first side of the heat dissipation layer and a second protective layer disposed on a second side of the heat dissipation layer opposite the first side.

16. The electronic device according to claim 14 , wherein the heat dissipation structure comprises a clad in which the heat dissipation layer and the protective layer are bonded.

17. The electronic device according to claim 14 , wherein the third area comprises a pattern comprising at least one recess.

18. The electronic device according to claim 14 , wherein the heat dissipation layer comprises at least one of copper, aluminum, or magnesium, and

wherein the protective layer comprises at least one of stainless steel, magnesium, titanium, or aluminum.

Assignments (1)

Priority Claims (1)

Continuity (2)

References Cited (31)