Patent Assignment
Reel/Frame 060575/0773
Assignment of Assignor's Interest
Recorded: 2022-07-21
Pages: 4
Assignors
YANG, TAI-I
Executed: 2017-05-02
CHU, WEI-CHEN
Executed: 2017-05-02
LIU, HSIANG-WEI
Executed: 2017-05-02
SHUE, SHAU-LIN
Executed: 2017-05-02
SU, LI-LIN
Executed: 2017-05-02
WU, YUNG-HSU
Executed: 2017-05-02
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Multi-Metal Fill with Self-Aligned Patterning and Dielectric with Voids