Multi-metal fill with self-aligned patterning and dielectric with voids
Photolithography overlay errors are a source of patterning defects, which contribute to low wafer yield. An interconnect formation process that employs a patterning photolithography/etch process with self-aligned interconnects is disclosed herein. The interconnection formation process, among other things, improves a photolithography overlay (OVL) margin since alignment is accomplished on a wider pattern. In addition, the patterning photolithography/etch process supports multi-metal gap fill and low-k dielectric formation with voids.
1. A method, comprising:
forming a first sacrificial structure with a first spacer and a second sacrificial structure with a second spacer on a substrate;
forming an opening in a photoresist layer on the first and second sacrificial structures, wherein the opening is above the first and second spacers, and wherein a width of the opening is greater than a width between the first and second spacers;
removing a portion of the substrate between the first and second spacers to form a via opening;
forming a via structure in the via opening;
removing the first sacrificial structure to form a metal line opening;
forming a metal line in the metal line opening; and
forming, on the metal line, a capping layer with a bottom surface coplanar with a top surface of the first spacer.
2. The method of claim 1 , further comprising:
removing the first spacer; and
forming a first dielectric layer in contact with each side surface of the via structure and the metal line, wherein the first dielectric layer comprises a void.
3. The method of claim 1 , wherein a top surface of the via structure is substantially coplanar with a top surface of the metal line.
4. The method of claim 1 , wherein:
forming the via structure comprises depositing a first metallic material; and
forming the metal line comprises depositing a second metallic material different from the first metallic material.
5. The method of claim 1 , further comprising forming a first oxide layer on the via structure and a second oxide layer on the metal line.
6. The method of claim 1 , further comprising:
forming at least one transistor with one or more contact layers in the substrate;
forming an interconnect layer over the one or more contact layers; and
forming a dielectric stack over the interconnect layer, wherein the via structure penetrates through the dielectric stack and is in contact with the interconnect layer.
7. A method, comprising:
forming a sacrificial structure on a substrate;
forming first and second spacers on opposing sidewalls of the sacrificial structure;
forming a metal line on the substrate and in contact with the first spacer;
removing the sacrificial structure to expose a portion of the substrate;
forming an opening in a photoresist layer on the first and second spacers, wherein a width of the opening is greater than a width between the first and second spacers;
removing the portion of the substrate to form a via opening; and
filling the via opening with a metal to form a via structure.
8. The method of claim 7 , further comprising:
removing the photoresist layer;
removing the first spacer;
forming a first dielectric layer in contact with each side surface of the via structure and the metal line, wherein the first dielectric layer comprises a void between the via structure and the metal line; and
forming a second dielectric layer over the first dielectric layer.
9. The method of claim 7 , wherein a top surface of the via structure is substantially coplanar with a top surface of the metal line.
10. The method of claim 7 , wherein the metal line comprises the metal.
11. The method of claim 10 , further comprising forming a first oxide layer on the via structure and a second oxide layer on the metal line.
12. The method of claim 7 , further comprising:
forming at least one transistor with one or more contact layers in the substrate;
forming an interconnect layer over the one or more contact layers; and
forming a dielectric stack over the interconnect layer, wherein the via structure penetrates through the dielectric stack and is in contact with the interconnect layer.
13. A method, comprising:
forming a first sacrificial structure and a second sacrificial structure on a substrate;
forming first and second spacers on opposing sidewalls of the first sacrificial structure, wherein the second spacer is between the first and second sacrificial structures;
forming a third spacer on a sidewall of the second sacrificial structure, wherein the third spacer is between the first and second sacrificial structures, and wherein a portion of the substrate is exposed between the second and third spacers;
forming an opening in a photoresist layer on the first and second sacrificial structures, wherein the opening is above the second and third spacers and has a width greater than a width of the portion of the substrate;
forming a metal structure in the opening; and
forming, on the metal structure, a capping layer with a bottom surface coplanar with a top surface of the second spacer.
14. The method of claim 13 , further comprising:
removing the first sacrificial structure to expose an other portion of the substrate;
forming an other opening in an other photoresist layer on the first and second spacers, wherein a width of the other opening is greater than a width of the other portion of the substrate; and
forming an other metal structure in the other opening.
15. The method of claim 14 , wherein forming the metal structure and the forming the other metal structure comprise removing at least one of the portion of the substrate and the other portion of the substrate.
16. The method of claim 14 , further comprising:
removing the second spacer;
forming a first dielectric layer in contact with the metal structure and the other metal structure, wherein the first dielectric layer comprises a void between the metal structure and the other metal structure; and
forming a second dielectric layer over the first dielectric layer and separated from the metal structure.
17. The method of claim 14 , wherein a top surface of the metal structure is substantially coplanar with a top surface of the other metal structure.
18. The method of claim 14 , wherein:
forming the metal structure comprises depositing a first metallic material; and
forming the other metal structure comprises depositing a second metallic material different from the first metallic material.
19. The method of claim 14 , further comprising forming a first metal oxide layer on the metal structure and a second metal oxide layer on the other metal structure.
20. The method of claim 14 , further comprising:
forming at least one transistor with one or more contact metal layers in the substrate;
forming an interconnect layer over the one or more contact metal layers; and
forming a dielectric stack over the interconnect layer, wherein at least one of the metal structure and the other metal structure penetrates through the dielectric stack and is in contact with the interconnect layer.