Patent Assignment
Reel/Frame 060583/0657
Assignment of Assignor's Interest
Recorded: 2022-07-21
Pages: 3
Assignee
JCET STATS CHIPPAC KOREA LIMITED
299, JAYUMUYEOK-RO, JUNG-GU, INCHEON, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device and Method of Forming Conductive Structure for EMI Shielding and Heat Dissipation