Semiconductor device and method of forming conductive structure for EMI shielding and heat dissipation
A semiconductor device has an antenna substrate and a component module disposed over the antenna substrate. The component module includes an electrical component, and a conductive structure formed around the electrical component. Alternatively, an electrical component can be disposed over the antenna substrate, and a conductive structure is disposed over the antenna substrate and around the electrical component. An encapsulant is deposited around the electrical component and conductive structure. A shielding material is formed over the component module, and a heat sink formed over the component module. The shielding material can be formed over the component module, while the heat sink is formed over the shielding material. Alternatively, the heat sink is formed over the component module, while the shielding material is formed over the heat sink. The conductive structure has a plurality of posts or a frame. A thermal interface material is disposed over the component module.
1. A method of making a semiconductor device, comprising:
providing an antenna substrate;
disposing a component module over the antenna substrate with the antenna substrate extending beyond the component module, wherein the component module includes,
(a) an electrical component, and
(b) a conductive structure formed around the electrical component;
forming a heat sink over the component module; and
forming a shielding material over the heat sink.
2. The method of claim 1 , wherein the conductive structure includes a plurality of posts or a frame.
3. The method of claim 1 , further including depositing an encapsulant around the electrical component and conductive structure.
4. The method of claim 1 , further including disposing a thermal interface material over the component module.
5. A method of making a semiconductor device, comprising:
providing an antenna substrate;
disposing a component module including an electrical component over the antenna substrate with the antenna substrate extending beyond the component module;
disposing a conductive structure over the antenna substrate and around the electrical component;
forming a heat sink over the electrical component and conductive structure; and
forming a shielding material over the heat sink.
6. The method of claim 5 , wherein the conductive structure includes a plurality of posts or a frame.
7. The method of claim 5 , further including depositing an encapsulant around the electrical component and conductive structure.
8. The method of claim 5 , further including disposing a thermal interface material over the electrical component.
9. The method of claim 5 , further including disposing an electrical connector over the antenna substrate.
10. A semiconductor device, comprising:
an antenna substrate;
a component module disposed over the antenna substrate with the antenna substrate extending beyond the component module, wherein the component module includes,
(a) an electrical component, and
(b) a conductive structure formed around the electrical component;
a heat sink formed over the component module; and
a shielding material formed over the heat sink.
11. The semiconductor device of claim 10 , wherein the conductive structure includes a plurality of posts or a frame.
12. The semiconductor device of claim 10 , further including an encapsulant deposited around the electrical component and conductive structure.
13. The semiconductor device of claim 10 , further including a thermal interface material disposed over the component module.
14. A semiconductor device, comprising:
an antenna substrate;
an electrical component disposed over the antenna substrate;
a conductive structure disposed over the antenna substrate and around the electrical component;
a shielding material formed over the electrical component and conductive structure; and
a heat sink formed over the electrical component and conductive structure, wherein the heat sink is formed over the electrical component and conductive structure, and the shielding material is formed over the heat sink.