Patent Assignment
Reel/Frame 060584/0370
Assignment of Assignor's Interest
Recorded: 2022-07-21
Pages: 3
Assignor
CHAKI, SHIN
Executed: 2022-06-24
Assignee
MITSUBISHI ELECTRIC CORPORATION
7-3, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, 100-8310, JAPAN
Covered Property
(1)
Semiconductor Device with Mmic and Pads Reducing Wire Length