Patent Assignment
Reel/Frame 060604/0478
Assignment of Assignor's Interest
Recorded: 2022-07-25
Pages: 6
Assignors
MAY, ROBERT ALAN
Executed: 2017-04-11
SALAMA, ISLAM A.
Executed: 2017-04-11
BOYAPATI, SRI RANGA SAI
Executed: 2017-04-11
LI, SHENG
Executed: 2017-04-11
DARMAWIKARTA, KRISTOF
Executed: 2017-04-11
SANKMAN, ROBERT L.
Executed: 2017-05-15
ALUR, AMRUTHAVALLI PALLAVI
Executed: 2017-04-11
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Microelectronic Device with Embedded Die Substrate on Interposer