Patent Assignment
Reel/Frame 060617/0391
Assignment of Assignor's Interest
Recorded: 2022-07-08
Pages: 7
Assignors
KIM, INKWON
Executed: 2022-02-07
BYUN, YEARIN
Executed: 2022-02-07
KIM, SANGKYUN
Executed: 2022-02-08
PARK, SANGHYUN
Executed: 2022-02-08
LEE, HYOSAN
Executed: 2022-02-08
HUR, WONKI
Executed: 2022-02-07
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Slurry Composition for Chemical Mechanical Polishing