Patent Assignment
Reel/Frame 060618/0280
Assignment of Assignor's Interest
Recorded: 2022-07-26
Pages: 3
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Forming a Cavity with a Wet Etch for Backside Contact Formation