Patent Assignment
Reel/Frame 060630/0973
Assignment of Assignor's Interest
Recorded: 2022-07-26
Pages: 3
Assignors
YEH, DER-CHYANG
Executed: 2022-07-14
YEH, SUNG-FENG
Executed: 2022-07-14
HONG, JIAN-WEI
Executed: 2022-07-14
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package and Manufacturing Method Thereof