Patent Assignment
Reel/Frame 060637/0207
Assignment of Assignor's Interest
Recorded: 2022-07-27
Pages: 6
Assignors
LEE, SANG HYUN
Executed: 2022-07-14
RHO, HOKYUN
Executed: 2022-06-30
JEONG, MIN HEE
Executed: 2022-07-14
Assignees
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
INDUSTRY FOUNDATION OF CHONNAM NATIONAL UNIVERSITY
77, YONGBONG-RO, BUK-GU, GWANGJU, KOREA, REPUBLIC OF
Covered Property
(1)
Electrode Structure Including Metal and Heat Dissipation Layer and Semiconductor Including the Electrode Structure