Assignment of Assignor's Interest

Recorded: 2022-07-12 Pages: 4

Assignors

SHIONO, TSUBASA

Executed: 2022-07-07

MABUCHI, YUICHIRO

Executed: 2022-07-07

Assignee

SHOWA DENKO K.K.

13-9, SHIBA DAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN

Covered Property (1)

SiC EPITAXIAL WAFER AND METHOD FOR MANUFACTURING SiC EPITAXIAL WAFER

Application: 17/862,933 →

Publication: US 2023/0026927

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.