Patent Assignment
Reel/Frame 060655/0323
Assignment of Assignor's Interest
Recorded: 2022-07-28
Pages: 3
Assignors
CHIANG, HUNG-LI
Executed: 2019-04-29
CHENG, CHAO-CHING
Executed: 2019-04-29
CHEN, TZU-CHIANG
Executed: 2019-04-29
CHEN, I-SHENG
Executed: 2019-05-03
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-77, TAIWAN
Covered Property
(1)
Isolation Structures of Semiconductor Devices