Patent Assignment
Reel/Frame 060674/0452
Assignment of Assignor's Interest
Recorded: 2022-07-29
Pages: 5
Assignors
HU, KUAN-KAN
Executed: 2022-07-19
HUANG, JHIH-RONG
Executed: 2022-07-19
LIAO, YI-BO
Executed: 2022-07-19
LIANG, SHUEN-SHIN
Executed: 2022-07-19
CHUANG, MIN-CHIANG
Executed: 2022-07-19
WANG, SUNG-LI
Executed: 2022-07-22
WOON, WEI-YEN
Executed: 2022-07-20
LIAO, SZUYA
Executed: 2022-07-19
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device and Manufacturing Method Thereof