Assignment of Assignor's Interest

Recorded: 2022-08-01 Pages: 2

Assignors

HANANO, MASAYUKI

Executed: 2022-07-14

KAWAKITA, JUNPEI

Executed: 2022-07-26

HAGA, KOUJI

Executed: 2022-07-21

Assignee

SHOWA DENKO MATERIALS CO., LTD.

9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN

Covered Property (1)

Polishing Agent, Stock Solution for Polishing Agent, and Polishing Method

Application: 17/792,227 →

Publication: US 2023/0094224

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.