Patent Assignment
Reel/Frame 060683/0077
Assignment of Assignor's Interest
Recorded: 2022-08-01
Pages: 9
Assignors
LIN, YUSHENG
Executed: 2017-02-21
STOUT, ROGER PAUL
Executed: 2017-02-21
CHEW, CHEE HIONG
Executed: 2017-02-23
TAKAKUSAKI, SADAMICHI
Executed: 2017-02-23
CARNEY, FRANCIS J.
Executed: 2017-02-23
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MD A700, PHOENIX, ARIZONA, 85008
Covered Property
(1)
Substrate Structures and Methods of Manufacture
Application:
17/816,455 →
Publication:
US 2022/0375833
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Nov 3, 2022
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 061879/0655 →
Release of Security Interest in Patents Recorded at Reel 061879, Frame 0655
Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: FAIRCHILD SEMICONDUCTOR CORPORATION; SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 064123/0001 →
Security Interest
Jul 13, 2023
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; GTAT CORPORATION
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 064271/0971 →