Patent Assignment
Reel/Frame 060689/0162
Assignment of Assignor's Interest
Recorded: 2022-08-01
Pages: 4
Assignors
YU, CHI-YANG
Executed: 2022-07-28
CHEN, CHIN-LIANG
Executed: 2022-07-28
HOU, HAO-CHENG
Executed: 2022-07-28
CHENG, JUNG WEI
Executed: 2022-07-28
LIANG, YU-MIN
Executed: 2022-07-28
WANG, TSUNG-DING
Executed: 2022-07-28
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device Packages and Methods of Forming the Same
Application:
17/878,647 →
Publication:
US 2024/0038646