Assignment of Assignor's Interest

Recorded: 2022-08-02 Pages: 4

Assignors

TANAKA, KENSHO

Executed: 2022-07-28

UMETA, YOSHIKAZU

Executed: 2022-07-28

Assignee

SHOWA DENKO K.K.

13-9, SHIBA DAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN

Covered Property (1)

SiC EPITAXIAL WAFER AND METHOD FOR MANUFACTURING SiC EPITAXIAL WAFER

Application: 17/879,118 →

Publication: US 2023/0039660

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.